Lead (Pb)–Free and Green Position Statement
The Western Design Center, Inc. (WDC), a pioneer in the licensing of microprocessor Intellectual Property and supplier of 65xx technology, is committed to achieving full compliance with the European Union RoHS Initiative and the Japan Green Procurement Standard Survey Initiative (JGPSSI).
WDC is moving forward with our efforts toward full compliance by working with our manufacturer and packaging company, and plan to be in full compliance by the July 1, 2006 deadline.
WDC defines Pb–Free to be products that do not contain the following six substances, as defined in the RoHS initiative.
- Hexavalent Chromium
- Polybrominated biphenyls (PBB)
- Polybrominated diphenyl ethers (PBDE)
WDC defines “Green” product to be RoHS compliant (Pb–Free), as well as free of materials in the JGPSSI, including Antimony, Bromine and Arsenic.
Part Number Designation for Green Parts
All of WDC’s Green parts will have a ‘G’ in the part number to designate that it is Green/RoHS compliant, as shown in the following example:
Please download each file you need.
WDC currently uses Taiwan Semiconductor Manufacturing Corporation (TSMC) as their FAB. The following WDC devices are manufactured by TSMC in FAB 2:
Production lines in FAB 2 are both RoHS and Green compliant. See the following documents indicating TSMCs compliance.
TSMC Certificate of Compliance TSMC Sony Green Partner Certificate
Previously, WDC devices were manufactured by Sanyo Semiconductor Corporation. All devices manufactured at Sanyo are both RoHS and Green compliant. WDC still has stock on wafers for the following devices manufactured by Sanyo:
Plastic Dual–In–Line (PDIP) and Plastic Leaded Chip Carrier (PLCC) packaging service is provided by GTK through Progate Group Corporation (PGC). GTK’s packaging service is RoHS and Green compliant.